Job Description:

-      Design and optimize semiconductor packaging processes to ensure product quality and performance meet requirements.

-      Develop new packaging processes, including selection of packaging materials, determination of packaging process parameters, etc.

-      Participate in the implementation and debugging of packaging processes, and solve process problems during production.

-      Design and evaluate packaging solutions to ensure products meet design specifications and cost requirements.

-      Collaborate closely with other teams, including design teams, process engineers, and production teams, to ensure smooth implementation of packaging processes.

-      Responsible for maintenance and management of packaging equipment to ensure normal operation.

-      Analyze and improve abnormalities in the packaging process to increase packaging yield and production efficiency.

-      Participate in the research and development of new technologies to continuously improve the technical level of packaging processes.

Qualifications:

-      Bachelor's degree or above in fields such as Microelectronics, Materials Science, Chemical Engineering, or related fields.

-      Familiar with semiconductor packaging processes, including adhesive packaging, ball grid array packaging, wire bonding, etc.

-      Experience in tuning and optimizing packaging process parameters, capable of solving process problems during packaging.

-      Ability to select and evaluate packaging materials.

-      Good teamwork and communication skills, able to collaborate with multiple teams to drive project progress.

-      Ability to independently solve problems and think innovatively, able to work under pressure and achieve goals.